Xiaomi, one of China’s leading tech giants, has announced its self-developed smartphone chip, the Xuanjie O1 (also known as Xring O1), built using second-generation 3-nanometer process technology. CEO Lei Jun confirmed on Monday that this advanced chip is set to debut on May 22, marking a significant milestone in Xiaomi’s journey into semiconductor development.
With this announcement, Xiaomi positions itself as the fourth company globally—following Apple, Qualcomm, and MediaTek—to design an in-house smartphone processor using the cutting-edge 3nm node technology. The Xuanjie O1 boasts an impressive 19 billion transistors and has been in development for four years.
“Chips are the underlying core track for Xiaomi to break through in cutting-edge technology,” Lei Jun stated on social media platform Weibo. He emphasized the company’s commitment to innovation, revealing plans to invest at least 50 billion yuan (approximately $6.9 billion) over the next decade in high-end chip development.
Xiaomi is renowned for its diverse range of products, from smartphones to electric vehicles, and the new chip underscores the company’s dedication to advancing technology. The Xuanjie O1 is expected to enhance Xiaomi’s competitiveness in the global smartphone market.
Monday’s announcement follows a teaser from Xiaomi Group President Lu Weibing during a live-streamed event on May 17, celebrating the company’s 15th anniversary. The introduction of the Xuanjie O1 chip highlights Xiaomi’s ongoing efforts to innovate and expand its technological capabilities.
