Huawei is Bridging Chip Gap with Science and Patience Says Ceo

Huawei CEO Ren Zhengfei Unveils Plan to Bridge U.S. Chip Gap

Despite facing strict U.S. export controls, Huawei’s CEO Ren Zhengfei remains optimistic about the tech giant’s future in the global chip race. In a recent interview published by the People’s Daily, Ren openly acknowledged that Huawei’s advanced chips are currently “one generation behind” their U.S. counterparts. But he’s confident that with innovation and patience, Huawei can close the gap.

“There’s no need to worry about the chip problem,” Ren assured. To tackle the challenges, Huawei is turning to advanced mathematical theories and creative engineering solutions. By “supplementing physics with advanced mathematics” and using “non-Moore’s Law approaches,” the company aims to enhance chip performance in unconventional ways.

One of Huawei’s strategies involves cluster computing—connecting multiple chips to work together seamlessly. An example is their newly launched AI CloudCluster 384 system, which integrates 384 Ascend 910C chips. This system has shown impressive performance, rivaling and even surpassing some competitors like Nvidia in certain metrics.

What sets Huawei apart is its significant investment in basic research. Ren revealed that about one-third of their massive 180-billion-yuan ($25 billion) annual research and development budget goes into foundational theoretical work. This kind of research doesn’t yield immediate results, but Ren believes it’s essential. “Without theory, there will be no breakthroughs, and we will not catch up with the U.S.,” he emphasized.

Ren’s leadership is all about strategic patience and steadfast focus. He isn’t swayed by external opinions—whether praise or criticism. Instead, he encourages his team to concentrate on “doing our job well” and progressing “step by step.” This approach, he believes, will cultivate the deep roots necessary for long-term technological success.

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